Thermal conductance measurements of bolted copper joints for SuperCDMS
CaltechAUTHORS
View Archive Info| Field | Value | |
| Title |
Thermal conductance measurements of bolted copper joints for SuperCDMS
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| Creator |
Schmitt, R. L.
Tatkowski, G. Ruschman, M. Golwala, S. R. Kellaris, N. Daal, M. Hall, J. Hoppe, E. W. |
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| Description |
Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Results obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.
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| Publisher |
Elsevier
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| Date |
2015-09
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| Type |
Article
PeerReviewed |
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| Relation |
http://resolver.caltech.edu/CaltechAUTHORS:20150820-094605136
http://authors.library.caltech.edu/59785/ |
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| Identifier |
Schmitt, R. L. and Tatkowski, G. and Ruschman, M. and Golwala, S. R. and Kellaris, N. and Daal, M. and Hall, J. and Hoppe, E. W. (2015) Thermal conductance measurements of bolted copper joints for SuperCDMS. Cryogenics, 70 . pp. 41-46. ISSN 0011-2275. http://resolver.caltech.edu/CaltechAUTHORS:20150820-094605136 <http://resolver.caltech.edu/CaltechAUTHORS:20150820-094605136>
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